• Matched products 20J1840‑404 (0.027 N·m) or 28J1851‑407 (0.1 N·m) + 2DM415 (0.21–1.50 A, DC 18–36 V) • Applicable equipment Routine optical trimming stages (microscope stage coarse adjustment), small inspection alignment fixtures, medical auxiliary positioning equipment, light optical precision adjustment devices • Technical features Ultra‑high micro‑stepping (256), micro‑step angle 0.007° for fine, uniform small‑stroke adjustment; Low vibration (<0.05 m/s²), noise <38 dB; Compact for integration into precision equipment, stable under long‑term low‑frequency trimming; Repeatability ±5–10 μm – meets basic micron‑level auxiliary applications, not sub‑micron core imaging accuracy; ISO Class 6–7 cleanliness (low‑particle design). • Selection boundary Only for auxiliary coarse adjustment and alignment; core imaging axes (sub‑micron required) must use Solution 4 (low‑voltage servo).

• Matched products 42J1848EC‑1000‑LS (0.5 N·m) or 57J1854EC‑1000‑LS (1.0 N·m, 1000 P/R) + 2HSS42 (0–2 A, DC 24–48 V) or 2HSS57 (0–5 A, DC 24–60 V) • Applicable equipment Mid‑range optical scanning/inspection equipment (confocal microscope scanning stages, non‑core imaging axes), high‑precision trimming stages, standard precision medical inspection instruments • Technical features 1000‑line encoder real‑time closed‑loop error correction, repeatability ±2–5 μm; Smooth, fine operation, low vibration and noise (<0.02 m/s², <40 dB); Eliminates long‑term micro‑stroke drift (<2 μm/24 h); Dynamic response and vibration suppression lower than low‑voltage servo (vibration ≥0.02 m/s²) – not for high‑end microscopy core axes; ISO Class 6 cleanliness. • Selection boundary Suitable for mid‑range inspection and auxiliary alignment; for high‑end microscopy (sub‑micron, vibration <0.005 m/s²), upgrade to Solution 4.

• Matched products 42J1848EC‑1000‑LS (0.5 N·m) + 2HSS57‑CN (low‑EMI closed‑loop drive with common‑mode choke and shielded terminals) • Applicable equipment Optical auxiliary equipment in EMI‑sensitive environments (non‑ultra‑sensitive sensors), medical inspection peripheral mechanisms • Technical features Enhanced EMC over standard closed‑loop, reducing radiated interference (conducted emissions meet CISPR 11 Class B); Accuracy ±2–5 μm; EMI better than standard closed‑loop but still below low‑voltage servo dedicated solutions; Suited for mid‑range auxiliary equipment with EMI requirements but not sub‑micron accuracy. • Selection boundary Suitable for auxiliary trimming in EMI‑sensitive environments; for core axes of high‑sensitivity sensors (e.g., electron microscopes, fluorescence imaging), use Solution 4 (low‑voltage servo).

• Matched products 60ASM400‑5‑17BCH (48 V, 400 W, rated 1.27 N·m, peak 2.54 N·m, 17‑bit encoder) + MCAC610‑23B‑EC (EtherCAT low‑voltage drive, 10 A, built‑in EMC filter) • Applicable equipment Fully automated optical imaging (wafer inspection microscope Z‑axis/XY scan), precision medical diagnostic instruments (digital pathology scanners), multi‑axis optical inspection platforms, high‑end medical precision scanning equipment • Technical features Optimised torque ripple (<1% rated), system vibration reduced to <0.005 m/s² (with precision guides); Built‑in EMC filter (meets EMI Class A) with shielded wiring and proper grounding greatly reduces EMI (conducted emission below 30 MHz limit); Combined with 17‑bit encoder and precision transmission (ballscrew C3 or higher) for sub‑micron positioning (±0.1–1 μm); Only minor slow accuracy drift over long operation (<0.3 μm/24 h), recoverable by regular calibration; Noise <38 dB, ISO Class 5 cleanliness; Bus‑based multi‑axis coordinated motion for complex scanning paths (jitter <1 μs); Selection constraint: For load >5 kg or higher thrust, upgrade to 750 W (80ASM750‑5‑17BCH, 2.38 N·m). • Selection boundary Core axes for wafer‑level imaging, micro‑diagnostics, and precision scanning must use this solution; auxiliary trimming may use Solution 1 or 2.

• Matched products IESV57‑30‑14‑36‑17BC‑EC (36 V, 140 W, rated 0.45 N·m, 17‑bit, EtherCAT) or IESV60‑30‑20‑36‑17BC‑EC (36 V, 200 W, rated 0.64 N·m) • Applicable equipment Compact optical scanning axes (portable inspection equipment mounting length ≤70 mm), precision alignment stage drives, multi‑axis optical inspection modules • Technical features Fully integrated drive, control, communication – minimal volume (axial length ~35 mm shorter than discrete); 17‑bit absolute encoder for sub‑micron accuracy (±0.1–1 μm); EtherCAT distributed control, sync <1 μs; Low vibration (<0.008 m/s²), noise <39 dB, ISO Class 5 cleanliness; Torque limit 0.64 N·m (peak ~1.9 N·m) – only for light‑load (≤2 kg) precision optical axes. • Selection boundary Suited for extremely compact, light‑load core optical axes; for load >3 kg or higher torque, upgrade to Solution 4 (discrete low‑voltage servo).

• Matched products IESV57‑30‑10‑36‑17BC (36 V, 100 W, rated 0.32 N·m, 17‑bit) or IESV60‑30‑20‑36‑17BC (36 V, 200 W, rated 0.64 N·m) • Applicable equipment High‑speed galvanometer scanning axes (light load ≤0.5 kg), fast auto‑focus mechanisms, high‑speed inspection scanning axes • Technical features Non‑backpack design, shortest motor length (≤60 mm) for extremely tight spaces; Ultra‑low rotor inertia (0.3×10⁻⁴ kg·m²), accel/decel <10 ms; 17‑bit encoder for sub‑micron positioning (±0.1–1 μm); Noise <37 dB, vibration <0.005 m/s² (with precision guides). • Selection boundary Suitable for high‑speed light loads (≤1 kg) with mounting length <70 mm in precision scanning; for load >2 kg or higher torque, upgrade to Solution 4.